JPH0248184B2 - - Google Patents
Info
- Publication number
- JPH0248184B2 JPH0248184B2 JP61075302A JP7530286A JPH0248184B2 JP H0248184 B2 JPH0248184 B2 JP H0248184B2 JP 61075302 A JP61075302 A JP 61075302A JP 7530286 A JP7530286 A JP 7530286A JP H0248184 B2 JPH0248184 B2 JP H0248184B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- resin
- conductivity
- coating film
- copper powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61075302A JPS62230869A (ja) | 1986-03-31 | 1986-03-31 | 半田付可能な導電塗料 |
DE8787104248T DE3782522T2 (de) | 1986-03-31 | 1987-03-23 | Leitfaehige kupferpastenzusammensetzung. |
EP87104248A EP0239901B1 (en) | 1986-03-31 | 1987-03-23 | Conductive copper paste composition |
US07/029,830 US4789411A (en) | 1986-03-31 | 1987-03-24 | Conductive copper paste composition |
CA000532964A CA1287557C (en) | 1986-03-31 | 1987-03-25 | Conductive copper paste composition |
AU70764/87A AU608215B2 (en) | 1986-03-31 | 1987-03-30 | Conductive copper paste composition |
KR1019870003053A KR910001805B1 (ko) | 1986-03-31 | 1987-03-31 | 도전성 동(銅) 페이스트(paste) 조성물 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61075302A JPS62230869A (ja) | 1986-03-31 | 1986-03-31 | 半田付可能な導電塗料 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62230869A JPS62230869A (ja) | 1987-10-09 |
JPH0248184B2 true JPH0248184B2 (en]) | 1990-10-24 |
Family
ID=13572319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61075302A Granted JPS62230869A (ja) | 1986-03-31 | 1986-03-31 | 半田付可能な導電塗料 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62230869A (en]) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01195611A (ja) * | 1988-01-30 | 1989-08-07 | Tatsuta Electric Wire & Cable Co Ltd | フラットケーブル |
JPH01253116A (ja) * | 1988-03-31 | 1989-10-09 | Tatsuta Electric Wire & Cable Co Ltd | テープ状電線 |
JPH01253115A (ja) * | 1988-03-31 | 1989-10-09 | Tatsuta Electric Wire & Cable Co Ltd | テープ状電線 |
US9190188B2 (en) * | 2013-06-13 | 2015-11-17 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film copper conductor compositions |
US9637648B2 (en) | 2015-08-13 | 2017-05-02 | E I Du Pont De Nemours And Company | Photonic sintering of a solderable polymer thick film copper conductor composition |
US9637647B2 (en) | 2015-08-13 | 2017-05-02 | E I Du Pont De Nemours And Company | Photonic sintering of a polymer thick film copper conductor composition |
CN110491543B (zh) * | 2019-07-30 | 2021-06-08 | 北京氦舶科技有限责任公司 | 一种触摸屏用导电银浆及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6028160B2 (ja) * | 1981-12-07 | 1985-07-03 | 三井東圧化学株式会社 | 導電回路の形成方法 |
JPS58160372A (ja) * | 1982-03-17 | 1983-09-22 | Toshiba Chem Corp | 導電性ペ−スト |
JPS6058268A (ja) * | 1983-09-08 | 1985-04-04 | Tsudakoma Ind Co Ltd | ロ−ラ接触式液剤付与装置のモ−タ制御方法 |
JPS6131454A (ja) * | 1984-07-23 | 1986-02-13 | Tatsuta Electric Wire & Cable Co Ltd | 導電性銅ペ−スト組成物 |
-
1986
- 1986-03-31 JP JP61075302A patent/JPS62230869A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62230869A (ja) | 1987-10-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |